发明名称 |
Electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance |
摘要 |
An electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance is made from a copper alloy containing 1.5 to 4.0 percent by mass of Ni, Si satisfying a Ni/Si mass ratio of 4.0 to 5.0, 0.01 to 1.3 percent by mass of Sn, and the remainder composed of copper and incidental impurities, wherein the average crystal grain size is 5 to 20 μm, the standard deviation of the crystal grain size satisfies 2σ<10 μm, and the proportion of the number of particles having a particle diameter of 90 to 300 nm in Ni—Si dispersed particles having a particle diameter of 30 to 300 nm is 20% or more, where the particles are observed in a cross-section defined by a direction perpendicular to a sheet surface and a direction parallel to a rolling direction. |
申请公布号 |
US9194026(B2) |
申请公布日期 |
2015.11.24 |
申请号 |
US201313798657 |
申请日期 |
2013.03.13 |
申请人 |
(Kobe Steel, Ltd.) |
发明人 |
Katsura Shinya |
分类号 |
C22C9/06;C22F1/08 |
主分类号 |
C22C9/06 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A copper alloy sheet, comprising:
Cu; 1.5 to 4.0 percent by mass of Ni; Si satisfying a Ni/Si mass ratio of 4.0 to 5.0; and 0.01 to 1.3 percent by mass of Sn, wherein the copper alloy sheet has an average crystal grain size of more than 10 μm and 20 μm or less, a standard deviation of the crystal grain size satisfies 2σ<10 μm, among Ni—Si dispersed particles having a particle diameter of 30 to 300 nm, a proportion of Ni—Si dispersed particles having a particle diameter of 90 to 300 nm is 20% or more when the particles are observed in a cross-section defined by a direction perpendicular to a sheet surface and a direction parallel to a rolling direction, and the copper alloy sheet is obtained by a process comprising: precipitating Ni—Si dispersed particles in at least one precipitation treatment after a hot rolling treatment and before a recrystallization treatment accompanied by a solution treatment. |
地址 |
Kobe-shi JP |