Method for manufacturing rigid-flexible printed circuit board

摘要

A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB.

主权项

1. A method for manufacturing a rigid-flexible printed circuit board, comprising:
providing a flexible printed circuit board comprising an insulation base and a first electrical trace layer formed on a first surface of the insulation base, the flexible printed circuit board comprising a first region, a second region connected to the first region, a first peripheral unwanted portion connected to the first region, and a second peripheral unwanted portion connected to the second region, the first region and second region defining a first borderline therebetween, the first region and the first peripheral unwanted portion defining a second borderline therebetween substantially perpendicular to the first borderline, the second region and the second peripheral unwanted portion defining a third borderline therebetween substantially perpendicular to the first borderline; forming a first protective film on the first electrical trace layer over the first region and part of the second region adjacent to the first region; forming a first peelable layer on the first protective film in the first region; providing a first adhesive tape and a first copper coil, the first adhesive tape defining a first slot corresponding to the first borderline; laminating the first copper coil, the first adhesive tape and the flexible circuit board together, an internal edge of the first slot being aligned along the first borderline, the first slot arranged within the first region; etching part of the first copper coil in the second region to form a first outer electrical trace layer, and removing the first copper coil in the first region; forming a second slot through the first adhesive tape along the second borderline, the second slot being in communication with the first slot; peeling off the first peelable layer and the first adhesive tape along the first slot and the second slot; and removing the first peripheral unwanted portion and the second peripheral unwanted portion along the second borderline and the third borderline to obtain a rigid-flexible printed circuit board, the rigid-flexible printed circuit board in the first region being a flexible portion, and the rigid-flexible printed circuit board in the second region being a rigid portion.