| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus which enables plasma processing on a division surface of a narrow space in a plasma processing apparatus performing plasma processing on a target region of a workpiece. <P>SOLUTION: A plasma processing apparatus includes: a power supply part 12 supplying electric power for generating discharge plasma P; and a pair of electrodes 16, 16 which the electric power is provided by the power supply part 12 and the discharge plasma P is generated therebetween. The pair of electrodes 16, 16 is provided so that the discharge plasma P traverses a target region 2 and contacts with the target region 2. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
