| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a grinding abnormality monitoring method and grinding abnormality monitoring device capable of improving the accuracy of grinding abnormality determination by setting a more appropriate threshold even when a work-reformed layer is generated in a workpiece. <P>SOLUTION: A threshold of grinding load for a grinding feed position is set based on a relationship between a change in grinding load when a workpiece W is ground and a resulting change in thickness of the work-reformed layer in the workpiece W. Thereby, even when the work-reformed layer is generated in the workpiece W, the work-reformed layer can be removed through subsequent grinding, and the accuracy of grinding abnormality determination can be improved. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
