| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in which some material of a polishing layer causes unsatisfactory conditioning or machining in forming macroscopic groove patterns in a pad surface.SOLUTION: A pad contains a polishing layer having a polishing surface. The polishing layer comprises a reaction product of ingredients, including: an isocyanate terminated urethane prepolymer having unreacted NCO groups; and a curative system containing a high molecular weight polyol curative and a difunctional curative. The polishing layer exhibits properties of a high density, a Shore D hardness, an elongation to break of 125 to 300%, a tensile modulus of 100 to 300 MPa, and a wet cut rate of 4 to 10 μm/min. |
