| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing/die-bonding film which makes possible to prevent the distance between chips for die boding from narrowing after the release from the state of being expanded, thereby preventing chips for die boding from being brought into contact with each other.SOLUTION: A dicing/die-bonding film comprises: a dicing tape; and a die-bonding film disposed on the dicing tape. The dicing tape has a yield point with an elongation percentage of 1-200% when being expanded at -15°C. |
