| 摘要 |
<p>A method of manufacturing a power module substrate in which a plurality of ceramic substrates and metal plates are alternately laminated, and bonded, and the metal plates on both sides of the ceramic substrates are in a connected state through penetration holes formed in the ceramic substrate, wherein, when the ceramic substrates and the metal plates are laminated, columnar metallic members that are longer than the penetration holes are inserted into the penetration holes in the ceramic substrate, and, when the ceramic substrates and the metal plates are bonded, the metallic members are pressurized and plastically deformed so that the metal plates on both sides of the ceramic substrates are bonded through the metallic members.</p> |
