SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package includes a package substrate, an MRAM chip, a first magnetic shield film, and a second magnetic shield film. The MRAM chip is arranged on an upper side of the package substrate. The MRAM chip is electrically connected to the package substrate. The first magnetic shield film attaches the MRAM chip to the package substrate. In addition, the first magnetic shield film blocks magnetic field interference between the MRAM chip and the package substrate. The second magnetic shield film is arranged on an upper side of the MRAM chip and blocks magnetic field interference on the upper side of the MRAM chip. Therefore, magnetic shield films can be arranged between bonding pads of the MRAM chip, and consequently magnetic field interference between the bonding pads can be prevented.