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发明名称
内藏元件之基板及内藏元件之基板的制造方法
摘要
申请公布号
TWI510151
申请公布日期
2015.11.21
申请号
TW100129329
申请日期
2011.08.17
申请人
名幸电子股份有限公司
发明人
户田光昭;今村圭男;长谷川琢哉
分类号
H05K1/18;H05K3/46
主分类号
H05K1/18
代理机构
代理人
洪澄文 台北市南港区三重路19之6号2楼
主权项
一种内藏元件之基板,其特征在于包括:树脂制之绝缘基材;电子内藏元件及虚拟内藏元件,埋设于上述绝缘基材之中;导体图样,透过上述内藏元件及虚拟内藏元件和连接层作直接或间接连接并且至少形成于上述绝缘基材之单面;及遮罩,形成于上述虚拟内藏元件之表面并且作为形成上述导体图样时之基准。
地址
日本
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