| 摘要 |
The present invention relates to a laminating system for a substrate which pressurizes a substrate wiring layer on a substrate core layer, and laminates the same. The system comprises: a loading apparatus which loads the substrate core layer and the substrate wiring layer to a pressurizing position; a pressurizing apparatus which pressurizes the substrate core layer and the substrate wiring layer loaded on the pressurizing position using at least a pair of pressuring rolls; a heating apparatus which heats the pressurizing rolls to make the substrate core layer and the substrate wiring layer be heated when the substrate core layer and the substrate wiring layer are pressurized by the pressuring rolls; a cutting apparatus which cuts the substrate core layer and the substrate wiring layer at a regular length; and an unloading apparatus which unloads the cut substrate core layer and substrate wiring layer. The heating apparatus includes a far-infrared heater which is separated from the pressurizing rolls, and partially surrounds the pressurizing rolls. |
