| 发明名称 |
SEMICONDUCTOR PACKAGE TESTING APPARATUS |
| 摘要 |
A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position. |
| 申请公布号 |
US2015331012(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201514710747 |
申请日期 |
2015.05.13 |
| 申请人 |
ASM Technology Singapore Pte Ltd |
发明人 |
SZE Chak Tong;TSAI Pei Wei;CHEUK Cho Hin;CHAN Si Ming;LEE Kam Sing |
| 分类号 |
G01R1/04 |
主分类号 |
G01R1/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package testing apparatus comprising:
a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station; probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package; and a restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder, the restraining mechanism at the second position being configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package. |
| 地址 |
Singapore SG |
