| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper tin alloy plating solution more excellent in cost than conventional copper-tin alloy plating bath and capable of being alternative of nickel plating.SOLUTION: There is provided a copper tin alloy plating solution containing the following components (a) to (f), (a) a soluble copper salt, (b) a soluble stannous salt, (c) inorganic acid, (d) one or more kind selected from among methionine, an isomer of methionine and a methionine derivative having a substituent group in a side chain of methionine, (e) one or more kind selected from among carboxylic acid, an alkali metal salt of carboxylic acid and an ammonium salt of carboxylic acid, (f) a surfactant having a polyoxyalkylene chain in a structure, the copper tin alloy plating solution having a copper/tin mass ratio of 80/20 to 60/40. |
