| 发明名称 |
CIRCUIT BOARD, IMAGE SENSOR UNIT, IMAGE READING APPARATUS, AND IMAGE FORMING APPARATUS |
| 摘要 |
A circuit board includes: a printed board including SWB pads for wire bonding and lands; image sensor ICs mounted on the printed board by a thermosetting adhesive and including FWB pads for wire bonding to be electrically connected to the SWB pads by wire bonding; and surface-mount elements mounted on the lands by soldering, wherein the surface-mount elements and the lands are connected by solders including bromine-containing flux, and coating films are formed on surfaces of the solders to prevent attachment of bromine to the SWB pads and the FWB pads. |
| 申请公布号 |
US2015334259(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201514698238 |
申请日期 |
2015.04.28 |
| 申请人 |
CANON COMPONENTS, INC |
发明人 |
MIHARA Akio |
| 分类号 |
H04N1/00;H05K1/18;H05K1/03;H04N1/191;H05K1/11 |
主分类号 |
H04N1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board comprising:
a printed board comprising board side pads for wire bonding and soldering lands; first elements mounted on the printed board by a thermosetting adhesive and comprising element side pads for wire bonding to be electrically connected to the board side pads by wire bonding; and second elements to be mounted on the lands by soldering, wherein the second elements and the lands are connected by solders including bromine-containing flux, and coating films are formed on surfaces of the solders to prevent attachment of bromine to the board side pads and the element side pads. |
| 地址 |
Kodama-gun JP |
