| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method that can suppress an alignment time from lengthening and prevent erroneous processing of a semiconductor chip.SOLUTION: An adhesive film (25) is mounted on the back surface of a semiconductor wafer (1) which has been separated into individual semiconductor chips (6), and the back surface of the adhesive film is supported by a support tape (26). Thereafter, the support tape side is mounted on a chuck table (30) of a laser processing device, and the semiconductor wafer is sucked and held through the support tape and the adhesive film by the chuck table. Under this sucked and held state, a protection tape (15) adhering to the surface (1a) side of the semiconductor wafer is exfoliated, and the adhesive film exposed to the gaps between the semiconductor chips is irradiated with a laser beam while the semiconductor wafer is sucked and held even after the exfoliation, and the adhesive film is broken along parting grooves (4). |
