ELECTRONIC COMPONENT MODULE

摘要

An electronic component module includes a substrate, an electronic component mounted on the substrate, and a resin sealing portion that seals the electronic component and covers a principal surface of the substrate. The resin sealing portion includes a film-shaped resin layer that covers upper and side surfaces of the electronic component and the principal surface of the substrate, and an embedding resin layer that covers the film-shaped resin layer. The embedding resin layer has a smaller coefficient of linear expansion than that of the film-shaped resin layer. A portion of the film-shaped resin layer covering the side surfaces has a smaller thickness than either of a thickness of a portion of the film-shaped resin layer covering the upper surface and a thickness of a portion of the film-shaped resin layer covering the principal surface.

主权项

1. An electronic component module comprising:
an electronic component; a substrate including a principal surface on which the electronic component is mounted; and a resin sealing portion that seals the electronic component and covers the principal surface of the substrate; wherein the resin sealing portion includes:
a film-shaped resin layer covering an upper surface and side surfaces of the electronic component and covering the principal surface of the substrate; andan embedding resin layer covering a front surface of the film-shaped resin layer located at a side opposite to the substrate; whereinthe embedding resin layer has a smaller coefficient of linear expansion than a coefficient of linear expansion of the film-shaped resin layer; anda portion of the film-shaped resin layer covering the side surfaces of the electronic component has a smaller thickness than either of a thickness of a portion of the film-shaped resin layer covering the upper surface of the electronic component and a thickness of a portion of the film-shaped resin layer covering the principal surface of the substrate.