发明名称 |
EMBEDDED TRACES |
摘要 |
A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material. |
申请公布号 |
US2015334825(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
US201414297516 |
申请日期 |
2014.06.05 |
申请人 |
Bahl Kenneth S.;Karavakis Konstantine;Carney Steve |
发明人 |
Bahl Kenneth S.;Karavakis Konstantine;Carney Steve |
分类号 |
H05K1/02;H05K3/18;H05K3/40;H05K1/11;C23C18/38;C23C18/20;C23C18/16;H05K1/03;H05K3/10;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for forming a printed circuit board, comprising:
forming trace channels in a laminate substrate, the laminate substrate including catalytic core material overlaid with non-catalytic material so that the laminate substrate resists metal plating except where catalytic core material is exposed, wherein the channels are ablated to expose the catalytic core material; immersing the laminate substrate in a metal bath so that the metal plates within the trace channels but not on unablated portions of the surface of the laminate substrate; and, planarizing the laminate substrate so that metal plated within the trace channel is flush with a surface of the laminate substrate. |
地址 |
Saratoga CA US |