| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition that has photosensitivity characteristics (sensitivity and resolution) equivalent to those of a photosensitive resin composition used for a buffer coat layer, has little damages in a half-cured film state by dry etching or Oashing, allows continuous press-bonding in the manufacture of a semiconductor device by stacking a plurality of semiconductor chips, and has buffer coat characteristics with excellent wetting and spreading properties upon stacking chips, and a method for manufacturing a semiconductor device and a semiconductor device using the above composition.SOLUTION: The photosensitive adhesive composition comprises (A) a phenolic resin, (B) a compound that generates an acid by light, (C) a thermal crosslinking agent having three or more groups that crosslink with the (A) component, and (D) an acrylic resin having a structural unit represented by general formula (1) below. |
