| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that an unintended current path is formed between a broken semiconductor switch and a signal ground of a control device and an excess current flows.SOLUTION: Provided is a control device which includes: a printed circuit board on which a switch IC as an IC package including a semiconductor switch for high-side driving a resistive load; and signal ground connection wiring. The control device includes: an overheat protection component including a first element which is connected to the switch IC and has a function of interrupting or limiting a current of the switch IC depending on temperature rise; and an excess current prevention component including a second element which is connected to the signal ground connection wiring and has a function of interrupting an excess current. |
