| 摘要 |
PROBLEM TO BE SOLVED: To provide: a semiconductor device which enables the change in the color of appearance of a resin of a semiconductor device with an inexpensive facility, and enables the enhancement of heat resistance; and a method for manufacturing such a semiconductor device.SOLUTION: A semiconductor device comprises: an AMB substrate 1; a semiconductor chip 11 electrically connected with the AMB substrate 1; an external terminal 13 electrically connected with the semiconductor chip 11; a first resin composition 15 including no coloring agent, partially sealing the AMB substrate 1, the semiconductor chip 11 and the external terminal 13, and having a glass transition temperature of 210°C or higher; and a second resin composition 16 covering the surface of the first resin composition 15, having a glass transition temperature higher than that of the first resin composition 15, and including a coloring agent. |
