发明名称 半導体発光装置の製造方法。
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light-emitting device capable of preventing variation in luminous color among products or that in a light emission plane. <P>SOLUTION: A plurality of light-emitting elements 20 are mounted on an element mounting surface of a substrate 10. A metal mold 120 contains a reference surface which includes a plurality of cavities 122 arranged in association with the array of the plurality of light-emitting elements on the substrate, and a phosphor containing resin 30, which contains phosphor particles 32 having average particle size of 5 &mu;m or larger, is supplied into the metal mold. The phosphor containing resin is compression-molded under such condition as the light-emitting elements are housed in the respective cavities while the element mounting surface a and the reference surface b tightly contact each other with the phosphor containing resin in between. In a step of the compression molding, a thickness L of the phosphor containing resin which is interposed between the element mounting surface and the reference surface is set to be 15 times or more of average particle size of the phosphor particle. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5816479(B2) 申请公布日期 2015.11.18
申请号 JP20110164230 申请日期 2011.07.27
申请人 发明人
分类号 H01L33/50;B29C43/18;B29C43/58;H01L33/52 主分类号 H01L33/50
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