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发明名称
Heat sink and method for fixing heat sink
摘要
A heat sink for cooling a device mounted on a mount board, the heat sink having a plurality of grooves at different heights in a surface opposite a surface in contact with the device.
申请公布号
EP2343736(A3)
申请公布日期
2015.11.18
申请号
EP20100189280
申请日期
2010.10.28
申请人
FUJITSU LIMITED
发明人
KAWANO, KAYOKO
分类号
H01L23/40
主分类号
H01L23/40
代理机构
代理人
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