| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polysiloxane-based composition having high heat resistance and light resistance, and excelling in gas barrier property and thermal shock resistance and good handleability in sealing an optical semiconductor device. <P>SOLUTION: The polysiloxane modified compound with a polyhedral structure is obtained by hydrosilylating a polysiloxane compound (b) obtained by mutually hydrosilylating polysiloxane-based compounds (a) with polyhedral structure having an alkenyl group and a hydrosilyl group, a compound (c) having not less than two hydrosilyl groups or alkenyl groups in one molecule, and a cyclic olefin compound (d) having one carbon-carbon double bond in one molecule. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
