EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, COMPOSITION AND HARDENED MATERIAL COMPRISING SAME, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP

摘要

The present invention relates to: an alkoxysilyl-based epoxy compound which does not require a separate silane coupling agent and exhibits outstanding heat resistance, and more specifically a low coefficient of thermal expansion (CTE) and a high glass transition temperature in a synergistic effect in a composite material; a composition and a cured article comprising same; a use for same; and a production method for an epoxy compound having an alkoxysilyl group. Accordingly, the present invention provides: an epoxy compound having an epoxy group and an alkoxysilyl group; and a composition comprising the epoxy compound together with a curing agent, a filler and/or a reaction catalyst or the like, and various uses for same including in a cured article and electronic components. According to the present invention, the novel epoxy composition comprising the epoxy compound having the alkoxysilyl group exhibits improved heat resistance, which is to say an effect whereby the CTE of the epoxy composite is reduced and whereby the glass transition temperature is elevated or a glass transition temperature is not exhibited (referred to hereinbelow as "Tg less"), because of chemical bond formation due to a chemical reaction of the alkoxysilyl group and the filler (fibres and/or particles) and a chemical reaction between alkoxysilyl groups, in the composite material and/or the cured article. Moreover, the cured article comprising the epoxy compound having the alkoxysilyl group according to the present invention exhibits outstanding flame retardancy due to the inclusion of the alkoxysilyl group.