DIPLEXER DESIGN USING THROUGH GLASS VIA TECHNOLOGY
摘要
A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.
申请公布号
EP2944027(A2)
申请公布日期
2015.11.18
申请号
EP20140703660
申请日期
2014.01.13
申请人
QUALCOMM INCORPORATED
发明人
ZUO, CHENGJIE;KIM, JONGHAE;VELEZ, MARIO FRANCISCO;LAN, JE-HSIUNG;KIM, DAEIK;YUN, CHANGHAN;BERDY, DAVID F;MIKULKA, ROBERT P.;NORWAK, MATTHEW M.;ZHANG, XIANGDONG;SEE, PUAY H