| 发明名称 | Preform including a groove extending to an edge of the preform | ||
| 摘要 | Embodiments include but are not limited to apparatuses and systems including a die or a preform including at least one groove configured to extend from at least one via of the die to an edge of the die. Other embodiments may be described and claimed. | ||
| 申请公布号 | US9190384(B2) | 申请公布日期 | 2015.11.17 |
| 申请号 | US201414221182 | 申请日期 | 2014.03.20 |
| 申请人 | TriQuint Semiconductor, Inc. | 发明人 | Liu Shixi Louis;Ma Wenlong;Chau Frank Hin-Fai;Lin Barry Jia-Fu |
| 分类号 | H01L23/00;H01L29/06;B23K35/02;H01L21/768 | 主分类号 | H01L23/00 |
| 代理机构 | Withrow & Terranova, P.L.L.C. | 代理人 | Withrow & Terranova, P.L.L.C. |
| 主权项 | 1. A preform comprising: a first surface; and a second surface, opposite the first surface, and including a groove to face a semiconductor die and extend from at least one via of the semiconductor die to an edge of the semiconductor die, wherein the perform is comprised of a solder material. | ||
| 地址 | Hillsboro OR US | ||