发明名称 Methods of forming phase change memory with various grain sizes
摘要 A memory device includes a phase change element, which further includes a first phase change layer having a first grain size; and a second phase change layer over the first phase change layer. The first and the second phase change layers are depth-wise regions of the phase change element. The second phase change layer has a second average grain size different from the first average grain size.
申请公布号 US9190610(B2) 申请公布日期 2015.11.17
申请号 US201314145646 申请日期 2013.12.31
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Liang Chun-Sheng;Lee Tzyh-Cheang;Yang Fu-Liang
分类号 H01L45/00;H01L21/44;H01L21/479 主分类号 H01L45/00
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A method of forming a memory device comprising: forming a cup shaped heater element, the cup having a ring shaped top surface; forming a patterned dielectric layer over the cup shaped heater element, the patterned dielectric layer having a trench therein exposing a portion of the ring shaped top surface while leaving covered a second portion of the ring shaped top surface; forming a fine grain phase change layer in the trench and in contact with the exposed portion of the ring shaped top surface; and forming a coarse grain phase change layer on the fine grain phase change layer.
地址 Hsin-Chu TW
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