发明名称 |
Methods of forming phase change memory with various grain sizes |
摘要 |
A memory device includes a phase change element, which further includes a first phase change layer having a first grain size; and a second phase change layer over the first phase change layer. The first and the second phase change layers are depth-wise regions of the phase change element. The second phase change layer has a second average grain size different from the first average grain size. |
申请公布号 |
US9190610(B2) |
申请公布日期 |
2015.11.17 |
申请号 |
US201314145646 |
申请日期 |
2013.12.31 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Liang Chun-Sheng;Lee Tzyh-Cheang;Yang Fu-Liang |
分类号 |
H01L45/00;H01L21/44;H01L21/479 |
主分类号 |
H01L45/00 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method of forming a memory device comprising:
forming a cup shaped heater element, the cup having a ring shaped top surface; forming a patterned dielectric layer over the cup shaped heater element, the patterned dielectric layer having a trench therein exposing a portion of the ring shaped top surface while leaving covered a second portion of the ring shaped top surface; forming a fine grain phase change layer in the trench and in contact with the exposed portion of the ring shaped top surface; and forming a coarse grain phase change layer on the fine grain phase change layer. |
地址 |
Hsin-Chu TW |