Light emitting device with encapsulant formed with barriers and light emitting device package having the same

摘要

Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.

主权项

1. A light emitting device comprising:
a light emitting diode chip; a plurality of barriers on a top surface of the light emitting diode chip, the barriers being separated from each other; and an encapsulant including a phosphor at an inner portion of the barriers on the light emitting diode chip, wherein a lateral width of the light emitting diode chip is substantially the same with a lateral width of the encapsulant including the phosphor, wherein the barriers comprise a dummy pad and a pad, and wherein the dummy pad is not electrically connected to the pad.