发明名称 マイクロ構造層の熱転写
摘要 <p>Articles having a component with a surface defining microstructured features can be formed using thermal transfer elements. One example of a suitable thermal transfer element includes a microstructured layer having a surface defining microstructured features imposed on the micro structured layer. The thermal transfer element is configured and arranged for the transfer of at least a portion of the microstructured layer to a receptor while substantially preserving the microstructured features of that portion.</p>
申请公布号 JP5814391(B2) 申请公布日期 2015.11.17
申请号 JP20140003094 申请日期 2014.01.10
申请人 发明人
分类号 B44C1/17;B81C99/00;B41M3/00;B41M5/382;B41M5/385;B41M5/40;B41M5/42;B81C1/00;H01J7/24;H01J9/02;H01L21/48;H01L21/68;H05K3/04 主分类号 B44C1/17
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