发明名称 発光素子パッケージを利用した照明装置
摘要 An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.
申请公布号 JP5813362(B2) 申请公布日期 2015.11.17
申请号 JP20110101500 申请日期 2011.04.28
申请人 三星電子株式会社Samsung Electronics Co.,Ltd. 发明人 文 敬 美;宋 永 僖;崔 一 興;李 庭 旭;李 永 鎭
分类号 F21S2/00;F21V29/83;H01L33/48 主分类号 F21S2/00
代理机构 代理人
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