发明名称 |
発光素子パッケージを利用した照明装置 |
摘要 |
An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module. |
申请公布号 |
JP5813362(B2) |
申请公布日期 |
2015.11.17 |
申请号 |
JP20110101500 |
申请日期 |
2011.04.28 |
申请人 |
三星電子株式会社Samsung Electronics Co.,Ltd. |
发明人 |
文 敬 美;宋 永 僖;崔 一 興;李 庭 旭;李 永 鎭 |
分类号 |
F21S2/00;F21V29/83;H01L33/48 |
主分类号 |
F21S2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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