Semiconductor device and manufacturing method of the same

摘要

A semiconductor package includes a semiconductor chip, a protruding pillar electrode provided on the semiconductor chip, and resin covering the semiconductor chip and the pillar electrode. The resin has a concave part and exposes a front edge portion of the pillar electrode from the resin at the bottom face of the concave part. The front edge portion of the pillar electrode is exposed from the concave part of the resin, which makes it possible to suppress increase in the height of the pillar electrode and to form the pillar electrodes having fine patterns or a narrow pitch.

主权项

1. A semiconductor device, comprising:
a first substrate; resin that covers the first substrate; a concave part provided in the resin; and a first electrode with a protruding shape, that is provided on the first substrate and includes a part exposed from the resin at a bottom face of the concave part; wherein the resin includes a part different from the concave part, the first electrode is located at an inner position than a side wall of the concave part, and an upper surface of the first electrode is located at a lower position than an upper surface of the part different from the concave part of the resin.