Induction soldering of photovoltaic system components

摘要

A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

主权项

1. A method comprising:
positioning a pair of photovoltaic wafers in a side-by-side arrangement; placing an interconnect on the pair of wafers such that the interconnect overlaps both wafers of the pair, a solder material being provided between the interconnect and the respective wafers; locating a solder head adjacent the interconnect, the solder head comprising: an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil, the magnetic field concentrator defining a passage extending axially through the eye of the coil; and energizing the coil to effect inductive heating of the solder material, wherein the magnetic field concentrator comprises an annular cylindrical core component extending through the eye of the coil, having an annular shoulder at an operatively upper end of the core component, the annular shoulder resting on the coil to locate the core component in the eye of the coil.