发明名称 Power spectrum analysis for defect screening in integrated circuit devices
摘要 A device sample is screened for defects using its power spectrum in response to a dynamic stimulus. The device sample receives a time-varying electrical signal. The power spectrum of the device sample is measured at one of the pins of the device sample. A defect in the device sample can be identified based on results of comparing the power spectrum with one or more power spectra of the device that have a known defect status.
申请公布号 US9188622(B1) 申请公布日期 2015.11.17
申请号 US201113309281 申请日期 2011.12.01
申请人 Sandia Corporation 发明人 Tangyunyong Paiboon;Cole, Jr. Edward I.;Stein David J.
分类号 G01R31/26;G01R27/28 主分类号 G01R31/26
代理机构 代理人 Finston Martin I.
主权项 1. A method of screening defects in a sample of a device, comprising: supplying a time-varying electrical signal to the sample between a power pin and a ground pin of the sample, wherein the time-varying electrical signal is periodic and has a sine-wave, square-wave, or periodic chirp waveform; measuring a power spectrum at a selected one of a plurality of pins of the sample wherein the measured power spectrum represents a response of the sample solely to said time-varying electrical signal and wherein, while measuring the power spectrum, each pin of the device other than the selected pin and the ground and power pins is floating or else biased at constant voltage; and identifying an indication of a defect in the sample based on results of comparing the power spectrum with one or more power spectra of the device that have a known defect status.
地址 Albuquerque NM US