| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning liquid that is used for a substrate for a semiconductor device, especially for a substrate for a semiconductor device having a metal wiring on the surface thereof in a cleaning process after a CMP process, has sufficient anticorrosion property against a metal wiring, can improve the compatibility with an object to be cleaned and polished, and can suppress scratch and abnormal oxidation on the substrate surface.SOLUTION: The substrate cleaning liquid for a semiconductor device is a cleaning composition liquid having a pH of 8 or higher which is used for cleaning a substrate for a semiconductor device having a Cu wiring and an insulation film having a low dielectric constant on the substrate surface after performing a chemical mechanical polishing, and includes a tetramethyl ammonium hydroxide, a diamine, an organic acid, a histidine or a derivative thereof, at least one kind selected from the group consisting of a benzotriazole, an imidazole, a triazole, a tetrazole and a derivative thereof, and water. |
