发明名称 ULTRASONIC PROBE
摘要 PROBLEM TO BE SOLVED: To provide an ultrasonic probe capable of releasing heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator.SOLUTION: The ultrasonic probe includes: a housing 70; a transducer 10 disposed in an interior of the housing 70 and configured to generate ultrasonic waves; a heat pipe 20 configured to transfer the heat generated by the transducer 10; a radiator 30 connected to the heat pipe 20 and configured to release the heat, which is transferred via the heat pipe 20, to the exterior of the housing 70; and a partition wall 50 configured to separate an inside space within the housing 70.
申请公布号 JP2015202401(A) 申请公布日期 2015.11.16
申请号 JP20150022275 申请日期 2015.02.06
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHO KYUNG-IL;SONG JONG KEUN;LEE SHOKEN;KIM BAE HYUNG;KIM YOUNG-IL
分类号 A61B8/00 主分类号 A61B8/00
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