| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment substrate capable of suppressing effectively decline of solder wettability generated in the case of long-term storage, by suppressing formation of an oxide film.SOLUTION: A surface treatment substrate has successively from the substrate side on the surface of the substrate, a nickel plating layer containing sulfur atoms as much as 0.01-0.13 wt%, and a treatment film comprising a treatment agent having a hydrophobic group and a hydrophilic group. |
