| 摘要 |
一种封装基板及封装件，该封装基板系包括：层状本体；形成在该层状本体之一表面上的复数第一电性连接垫、第二电性连接垫及第三电性连接垫，其系个别用以接置导电凸块，该第三电性连接垫系位在该第一电性连接垫及第二电性连接垫所接置的该导电凸块之间的区域外；以及形成于该层状本体中的复数第一导电盲孔、第二导电盲孔、第三导电盲孔、第一内部导电迹线、第二内部导电迹线及第三内部导电迹线，该等导电盲孔系使该等电性连接垫分别连接该等内部导电迹线。本发明能避免导电凸块与导电迹线桥接及避免导电凸块因防焊层而不沾锡。; a first electrical connection pad, a second electrical connection pad and a third electrical connection pad that are formed on one surface of the lamellar body, each separately sets a conductive bump, the third electrical connection pad is located outside an area between the conductive bumps set by the first electrical connection pad and the second electrical connection pad; and a first conductive blind hole, a second conductive blind hole, a third conductive blind hole, a first internal conductive trace, a second internal conductive trace and a third internal conductive trace formed within the lamellar body, the conductive blind holes enable the electrical connection pads separately connect the internal conductive traces. This invention can avoid conductive bump and conductive trace bridging and avoid conductive bump non-wetting due to solder mask layer. |
