| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition which can allow both of an alloy material and a resin to be polished at a high polishing speed by reducing a difference between the polishing speed of the alloy material and that of the resin when a substrate, the composition containing the alloy material and the resin on the surface thereof and having a specific ratio of the area of the alloy material to that of the entire surface thereof, being polished and being able to allow the polished surface of the substrate to have excellent smoothness and high gloss.SOLUTION: The polishing composition is used for polishing the substrate, contains the alloy material and the resin on the surface thereof, and has 60-95% of the ratio of the area of the alloy material to that of the entire surface thereof. The polishing composition contains: crystalline abrasive grain having 5.0 μm of 50% cumulative particle diameter (D), which is based on a volume-based particle size distribution; an acid or salt thereof; and a water-soluble polymer. |
