| 摘要 |
PROBLEM TO BE SOLVED: To suppress occurrence of warp of a copper alloy material even when temperature rising and temperature lowering are repeated.SOLUTION: A copper alloy material is formed planar by rolling. When, after heating of the copper alloy material at 500-900°C for one h or more, a plurality of crystal orientations of the crystal plane present in the surface of the copper alloy material are measured, with crystal planes having a crystal orientation at an inclination from the crystal orientation of the (100) plane of 10° or smaller expressed as (100) planes, the ratio of the total area of (100) planes present in the surface to the area of the surface is 85% or higher. |
