| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component loading device having means capable of removing foreign matters adhering to an electronic component with a compact construction.SOLUTION: An electronic component loading device has an electronic component feeding unit 10 for taking out an electronic component from a component supply part by a suction head 13 and delivering the electronic component to a loading head while the electronic component is reversed in the up-and-down direction, and foreign matter removing means for spraying air to the electronic component delivered to the loading head by an air blow tool 21 to remove the foreign matters adhering to the electronic component. A work of removing foreign matters adhering to a bump forming face of the electronic component jets air from an air blow hole 21a of the air blow tool 21 obliquely upwards after the electronic component is delivered to the loading head by the electronic component feeding unit 10. The jetting of the air is continued until the air blow tool 21 has been passed below the electronic component in the processing that the electronic component feeding unit 10 moves in the arrangement direction of the component supply part. |
