| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method which prevents dissolution of the resin.SOLUTION: At first, in a paste solder coating step 101, the terminal of a metal frame fixed to a resin case by insert molding is coated with a minimum amount of paste solder. Subsequently, in an electronic component mounting step 102, an electronic component is mounted on the terminal of a metal frame. Thereafter, in an electronic component temporary fixing step 103, the electronic component is fixed temporarily by means of a holding jig. Finally, in a laser light irradiation step 104, the paste solder is locally irradiated with laser light, and after the paste solder is dissolved, a thread solder is supplied and dissolved before completing laser light irradiation. |
