发明名称 |
METHODS OF SELECTIVE EPITAXIAL SILICON TRENCH FILLS |
摘要 |
Provided is a method for selectively forming an epitaxial film on a surface of a substrate in comparison with a surface of a dielectric material. The substrate surfaces is capable of forming a target surface-terminating unit differentiated by pretreatment, and producing at least one protecting group by additionally reacting the target surface-terminating unit. The protecting group inhibits growth of a subsequent epitaxial film on the protected surface. |
申请公布号 |
KR20150126784(A) |
申请公布日期 |
2015.11.13 |
申请号 |
KR20150061627 |
申请日期 |
2015.04.30 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
THOMPSON DAVID;KACHIAN JESSICA SEVANNE;SALY MARK;BAUER MATTHIAS;UNDERWOOD BRIAN;CHU SCHUBERT |
分类号 |
H01L21/762;H01L21/314;H01L21/36 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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