发明名称 METHODS OF SELECTIVE EPITAXIAL SILICON TRENCH FILLS
摘要 Provided is a method for selectively forming an epitaxial film on a surface of a substrate in comparison with a surface of a dielectric material. The substrate surfaces is capable of forming a target surface-terminating unit differentiated by pretreatment, and producing at least one protecting group by additionally reacting the target surface-terminating unit. The protecting group inhibits growth of a subsequent epitaxial film on the protected surface.
申请公布号 KR20150126784(A) 申请公布日期 2015.11.13
申请号 KR20150061627 申请日期 2015.04.30
申请人 APPLIED MATERIALS, INC. 发明人 THOMPSON DAVID;KACHIAN JESSICA SEVANNE;SALY MARK;BAUER MATTHIAS;UNDERWOOD BRIAN;CHU SCHUBERT
分类号 H01L21/762;H01L21/314;H01L21/36 主分类号 H01L21/762
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