发明名称 WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVANESCENT WAVE COUPLING
摘要 A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when. the cover wafer is bonded to the device wafer.
申请公布号 US2015321905(A1) 申请公布日期 2015.11.12
申请号 US201414270945 申请日期 2014.05.06
申请人 Raytheon Company 发明人 Gooch Roland W.;Black Stephen H.;Kocian Thomas A.;Kennedy Adam M.;Diep Buu Q.
分类号 B81B7/00;H01L37/00 主分类号 B81B7/00
代理机构 代理人
主权项 1. A structure for detecting electromagnetic radiation having a predetermined wavelength, comprising: a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation; a cover wafer having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element; a bond gap spacer structure for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a predetermined distance less than a fraction of the predetermined wavelength when the cover wafer is bonded to the device wafer.
地址 Waltham MA US