发明名称 Power Semiconductor Device with Low RDSON and High Breakdown Voltage
摘要 A semiconductor structure is disclosed. The semiconductor structure includes a trench having substantially parallel trench sidewalls, and a tapered dielectric liner in the trench. The tapered dielectric liner includes slanted dielectric sidewalls. A conductive filler is enclosed by the slanted dielectric sidewalls in the trench.
申请公布号 US2015325685(A1) 申请公布日期 2015.11.12
申请号 US201514685257 申请日期 2015.04.13
申请人 International Rectifier Corporation 发明人 Henson Timothy D.;Ma Ling;Kelkar Kapil;Radic Ljubo;Burke Hugo;Jones David Paul
分类号 H01L29/66;H01L21/306;H01L21/28;H01L29/78;H01L29/423 主分类号 H01L29/66
代理机构 代理人
主权项 1. A semiconductor structure comprising: a trench having substantially parallel trench sidewalls; a tapered dielectric liner in said trench, said tapered dielectric liner having slanted dielectric sidewalls; a conductive filler enclosed by said slanted dielectric sidewalls.
地址 EI Segundo CA US