发明名称 |
Power Semiconductor Device with Low RDSON and High Breakdown Voltage |
摘要 |
A semiconductor structure is disclosed. The semiconductor structure includes a trench having substantially parallel trench sidewalls, and a tapered dielectric liner in the trench. The tapered dielectric liner includes slanted dielectric sidewalls. A conductive filler is enclosed by the slanted dielectric sidewalls in the trench. |
申请公布号 |
US2015325685(A1) |
申请公布日期 |
2015.11.12 |
申请号 |
US201514685257 |
申请日期 |
2015.04.13 |
申请人 |
International Rectifier Corporation |
发明人 |
Henson Timothy D.;Ma Ling;Kelkar Kapil;Radic Ljubo;Burke Hugo;Jones David Paul |
分类号 |
H01L29/66;H01L21/306;H01L21/28;H01L29/78;H01L29/423 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
|
主权项 |
1. A semiconductor structure comprising:
a trench having substantially parallel trench sidewalls; a tapered dielectric liner in said trench, said tapered dielectric liner having slanted dielectric sidewalls; a conductive filler enclosed by said slanted dielectric sidewalls. |
地址 |
EI Segundo CA US |