| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to easily remove an adhesive.SOLUTION: A semiconductor device manufacturing method comprises: a step of temporarily bonding a first surface 11 of a semiconductor wafer 10 to a first substrate 20 via a first adhesive 22; a step of temporarily bond a second surface 12 of the semiconductor wafer 10 opposite to the first surface 11 to a second substrate 30 via a second adhesive 32 in a manner such that lateral faces of the first adhesive 22 are exposed and lateral faces of the second adhesive 32 are not exposed; and a step of separating the first substrate 20 from the semiconductor wafer 10 in a state where the semiconductor wafer 10 is temporarily bonded to the second substrate 30. |
