| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device combining productivity with heat dissipation property, and a method of manufacturing the same.SOLUTION: A light-emitting device 100 comprises: a light-emitting element 1 that has an n-side electrode 13 and a p-side electrode 15 on one surface of a semiconductor laminate 12; and a support 3 using a resin layer 31 provided on the one surface side of the semiconductor laminate 12 as a base material. The resin layer 31 has in the inside thereof, metal layers 33n and 33p and metal wires 32n and 32p. As the metal wires 32n and 32p, ribbon-shaped wires are used, and their lateral faces are connected with the metal layers 33n and 33p, and their end surfaces are provided so as to be exposed from a lateral face of the resin layer 31. Exposure surfaces from the resin layer 31, of the metal wires 32n and 32p are coated with external connection electrodes 34n and 34p. Lower ends of the exposure surfaces in the longitudinal-direction lateral faces of the metal wires 32n and 32p are provided so as to be apart from the semiconductor laminate 12 further compared with the upper surfaces of the metal layers 33n and 33p. |
