METHOD AND DEVICE FOR PERMANENT BONDING

摘要

The invention relates to a method for permanently bonding a first layer (2) of a first substrate (1) to a second layer (2') of a second substrate (1') at a bonding boundary surface (5), characterized in that a density of dislocations (4) in the first and/or second layers (2, 2') is increased at least in the region of the bonding boundary surface (5) prior to and/or during the bonding process. The invention further relates to a corresponding device.