| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED light-emitting device and a manufacturing method of the same where emission efficiency as an LED is improved by using transparent resin where there is no risk, such as a white member covering type LED light-emitting device, of occurrence of adhesion of a coating member to an LED light extraction surface and occurrence of stray light.SOLUTION: A light-emitting surface side of a bump-mounted light-emitting element 1 is bonded to a phosphor plate 2 of a shape larger than a contour of the light-emitting element 1 with transparent adhesive. Transparent resin 4 is filled between a side face of the light-emitting element 1 and a bottom face of the phosphor plate 2. A light-emitting element chip 1A is constructed so that a shape of the filled transparent resin 4 is formed in an arc shape toward the phosphor plate from a corner of a mounting surface side of the light-emitting element 1. The light-emitting element chip 1A is flip-chip mounted on a wiring electrode 5a on a circuit board 7. |
