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发明名称
基材表面图案化方法及其半导体发光元件
摘要
申请公布号
TWI508325
申请公布日期
2015.11.11
申请号
TW100117940
申请日期
2011.05.23
申请人
隆达电子股份有限公司
发明人
余长治;锺木郎;林孟毅
分类号
H01L33/22
主分类号
H01L33/22
代理机构
代理人
张耀晖 台北市大安区敦化南路2段71号18楼;庄志强 台北市大安区敦化南路2段71号18楼
主权项
一种基材表面图案化方法,包括以下步骤:提供一基材;在该基材表面形成复数个奈米金属氧化物颗粒作为蚀刻遮罩部,针对未被该些奈米金属氧化物颗粒所遮蔽之该基材进行蚀刻,以于该基材的表面上形成复数个奈米微结构;继续利用该些奈米微结构作为遮蔽物于该基材表面进行一磊晶步骤,于该磊晶步骤开始初期,磊晶层不会成长在遮蔽层上,而仅成长在未设置有遮蔽层的基材表面上;以及继续磊晶步骤于该基材表面形成第一型半导体层、主动层、第二型半导体层等半导体层,以构成一发光半导体元件。
地址
新竹市科学园区工业东三路3号
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