发明名称 レーザ加工装置、第1ユニット、及び第2ユニット
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device, a first unit, and a second unit which allow a user to replace a laser oscillator or a galvano-scanner easily.SOLUTION: A laser processing device 1 comprises: a first box 11 of a first unit 1A storing a laser oscillator 14F; and a first box 21 of a second unit 1B storing a galvano-scanner 23H and an imaging optical system device 22N. The first box 11 of the first unit 1A and the first box 21 of the second unit 1B are detachable. Therefore, replacement of the laser oscillator 14F and the galvano-scanner 23H can be performed easily.
申请公布号 JP5812034(B2) 申请公布日期 2015.11.11
申请号 JP20130071000 申请日期 2013.03.29
申请人 ブラザー工業株式会社 发明人 西井 一浩
分类号 B23K26/00;H01S3/02 主分类号 B23K26/00
代理机构 代理人
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