发明名称 Electronic control apparatus for vehicle using radiation board and manufacturing method thereof
摘要 Disclosed are an electronic control apparatus for a vehicle and provides an electronic control apparatus for a vehicle using a radiation board in which a radiation plate having a slide fixing structure (for example, “U” shaped) is attached onto a portion opposite to a portion which requires the radiation in a printed circuit board (PCB) and if additional radiation performance is required, a slidable radiation board which is detachable is attached/detached to directly emit heat to the atmosphere through the radiation plate and the radiation board to the atmosphere, thereby improving a radiation effect and to implement a standard platform of the radiation structure and implement an optimal radiation structure through a slidable radiation board and a manufacturing method thereof.
申请公布号 US9185831(B2) 申请公布日期 2015.11.10
申请号 US201314139836 申请日期 2013.12.23
申请人 HYUNDAI AUTRON CO., LTD. 发明人 Moon Hyung Joon
分类号 H05K7/20;H05K13/00;G06F1/20;H05K5/06;H01L21/44;H05K5/00 主分类号 H05K7/20
代理机构 Mayer Brown LLP 代理人 Mayer Brown LLP ;Park Hyunho
主权项 1. An electronic control apparatus for a vehicle, comprising: a printed circuit board (PCB) which includes an electronic control substrate which electrically controls multiple parts of a vehicle and electronic components installed on one surface of the electronic control substrate; a radiation plate which is attached onto another surface which is opposite to the one surface on which the electronic components is located among the other surfaces of the electronic control substrate in order to radiate heat of the electronic components and has a slide fixing structure; a radiation board which has at least one radiation pin formed on one surface thereof and is slidably attached/detached onto/from the slide fixing structure of the radiation plate; a connector which includes a connector pin and is coupled to the PCB; and an overmold housing which overmolds the PCB onto which the radiation plate is attached using a mold resin and overmolds the remaining portion other than another surface onto which the radiation plate is attached among the other surfaces of the electronic control substrate.
地址 Seongnam-Si KR